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Exposure system for MEMS

A mask moves during (UV) radiation and controls the energy incident on the photoresist surface, thereby enabling fabrication of 3D microstructures with arbitrary curve or slope.

Main feature
  • Our original mirror & lens optical system realizes uniform radiation covering the full exposure area.
  • Equipped with gap sensors for non-contact gap making with a good in-plane uniformity, and an alignment system composed of microscopes and a XYθstage for aligning the existing layer(s) on a substrate to a mask pattern.
  • In the "Moving UV mask" method (in which a piezo stage micropositions a mask during exposure), the thick resist's sidewall slope angle is controllable, thereby fabricating 3D microstructures is possible.

Example of 50μ-thick resist pattern

Mask travel =20μm


Mask travel =Φ25μm


Main spec
Mask size Max 9" x 9" x t3.0 mm
Substrate size Max Φ8"(Wafer)
Light source Super high-pressure mercury lamp :500W or 1kW
Outer dimensions and weights Main body dimensions W2120 x D1305 x H1850 mm
Main body weight 640kg

※Custom substrate size, mercury lamp wattage or other special spec available.

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