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Maskless exposure system

Developed by our joint company: INDEX TECHNOLOGIES INC.

Directly drowning a pattern image on a substrate plate is possible by employing their original high speed imaging method "Point of Array".

Main feature
  • Direct imaging exposure is applicable to experimentation, research, prototype, small-lot production, or etc.
  • Applications range from high-end PCBs, high density packaging, flat panel displays, etc. to the micromachining field like MEMS, etc.
  • No photomask is needed in the lithography process, which minimizes development cost and time lag to the market.
  • Also, custom system composition is available to meet the customers' requests.
Main spec
  MX-1201 MX-1201 MX-1201E MX-1204 MX-1702E
Min. line thickness (※1) 5μm 5μm 3μm 1μm 10μm
Imaging resolution 0.5μm 0.5μm 0.25μm 0.122μm 1.0μm
Max. substrate size 200 x 200mm 200 x 200mm 200 x 200mm 150 x 150mm 550 x 650mm
Effective exposure area 200 x 200mm 200 x 200mm 200 x 200mm 150 x 150mm 550 x 650mm
Main laser wavelength 405±5nm 375±5nm 405±5nm 375±5nm 405±5nm
Exposure scan speed 43.9mm/s 22.5mm/s 10.9mm/s 92.2mm/s
Number of optical engines 1 7

※1 It may vary by photoresist used or developing conditions, etc.

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