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Maskless exposure system

Developed by our joint company: INDEX TECHNOLOGIES INC.

Directly drowning a pattern image on a substrate plate is possible by employing their original high speed imaging method "Point of Array".

Main feature
  • Direct imaging exposure is applicable to experimentation, research, prototype, small-lot production, or etc.
  • Applications range from high-end PCBs, high density packaging, flat panel displays, etc. to the micromachining field like MEMS, etc.
  • No photomask is needed in the lithography process, which minimizes development cost and time lag to the market.
  • Also, custom system composition is available to meet the customers' requests.
マスクレス露光装置
Main spec
Type MX-1201 MX-1201E MX-1205
Minimum line width (※1) [nm] 5 3 2 1
Data resolution [nm] 0.488 0.25 0.1 0.05
Maximum substrate size [mm] 200 x 200 200 x 200 100 x 100
Effective exposure area [mm] 200 x 200 200 x 200 100 x 100
Peak wave length [nm] 405 375 405 + 375 405 375 375
Scanning speed [mm/s] 43.94 22.5 9 4.5
Tact time (※2) [s,min] 180 [s] 320 [s] 16 [min] 27 [min]
Maximum exposure (※3) [mJ/c㎡] 245 70 245 + 70 460 135 50 100


※1 Value varies according to the conditions (Ex. photo-resist,film thickness, and development conditions)
※2 The alignment time is excluded.
※3 Under the maximum scanning speed.

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