Main feature
- Original high-speed image processing technology allows highly accurate mask alignment with wafer.
- Auto-mask changer is mounted. Applicable to mask library.
- Non-contact pre-aligner is mounted. High precision feeding is achieved without damaging substrates.
- DNK original parallel compensating mechanism accurately controls proximity gap.
- Original mirror optical system is mounted. Uniform illumination over irradiated plane and high intensity are achieved.
- Up to 2 cassettes can be set for each loader and unloader. (Option)
- Temperature of the substrate stage and masks can be controlled with the cooling system. (Option)
| MA-4301M | ||
|---|---|---|
| Wafer Size | Material | Si,Glass |
| Dimension | Φ6″ x t0.625 mm(6″ = Φ150 mm) +/- 0.2 mm | |
| Φ8″ x t0.725 mm(8″ = Φ200 mm) +/- 0.2 mm | ||
| Tact Time | Proximity exposure：19 s/wafer (One parallelism compensation per lot) |
|
| Alignment Accuracy | Auto alignment：+/- 1 μm (Peak search) |
|
| Gap | 1 to 200 μm Servo motor Setup resolution：1 μm |
|
| Resolving Power | Soft contact exposure Hard contact exposure Proximity exposure |
|
| Dimensions & Weight | Main body dimensions：W 1800 x D 1650 x H 2015 mm Total weight(including lamp house)：1400 kg |
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